The 3rd Annual International Conference on Information System and Artificial Intelligence [ISAI2018] will be held on June 22-24, 2018 in Suzhou, Jiangsu, China. It aims to provide a forum for researchers, practitioners, and professionals from both the industry and the academia to share their newest research findings and results. The conference will be held every year to make it an ideal platform for people to share views and experiences in information system and artificial intelligence and related areas.
The dedicated conference teams are currently working hard on making this conference not only intellectually stimulating but also an unforgettable pleasant experience.
We look forward to welcome you in ISAI 2018and wish you a fruitful and enjoyable stay in Suzhou.
The 2016 International Conference on Information System and Artificial Intelligence [ISAI 2016] has been held on June 24-26, 2016 in Hong Kong, China. The conference proceeding has been published by IEEE-CPS and has been indexed by EI.
ISAI2017have been successfully hosted and the conference proceeding have been indexed by EI and CPCI after 1 months later.
All submissions must be original, unpublished, and not submitted concurrently for publication elsewhere.
All accepted paper by ISAI2018 will be published by:
IOP Conference Series (https://conferenceseries.iop.org/content/home):
Journal of Physics: Conference Series (JPCS)
Online ISSN: 1742-6596
Print ISSN: 1742-6588
Indexed by Ei Compendex, Scopus, CPCI/ ISTP, Inspec, etc
本次会议录用文章将由英国皇家物理学会(IOP Publishing)旗下期刊Journal of Physics: Conference Series (JPCS)出版，提交的检索机构为： EI Compendex，Scopus，Inspec and CPCI-S (the proceedings database of ISI Web of Science, 即ISTP), IOP提交EI数据库检索情况稳定，可登陆贵校EI数据库自行查看近期检索情况。
Submission Deadline: June 15th, 2018 (最后一轮，不再延期)
Submission method: http://www.chairin.cn/login?conf=isai2018
ISAI2018 Paper Template
Specific topics of interest include, but are not limited to, the following:
Topic 1: Computer Science and Information System
Topic 2: Robotics and Artificial Intelligence
Topic 3: Integrated Applications and Other Related Fields